Organic light emitting diode display and manufacturing method thereof

ABSTRACT

Disclosed are an organic light emitting diode display and a manufacturing method thereof, and, more particularly, an organic light emitting diode display which includes an encapsulation layer including an inorganic layer containing carbon at a level of about 0.2 wt % to about 6.2 wt % and an organic layer and a manufacturing method thereof.

CLAIM OF PRIORITY

This application makes reference to, incorporates the same herein, andclaims all benefits accruing under 35 U.S.C. §119 from an applicationfor ORGANIC LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHODTHEREOF earlier filed in the Korean Intellectual Property Office on 20Aug. 2012 and there duly assigned Serial No. 10-2012-0090580.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present disclosure relates to an organic light emitting diodedisplay and a manufacturing method thereof, and, more particularly, toan organic light emitting diode display which includes an encapsulationlayer including an inorganic layer containing carbon of 0.2 wt % to 6.2wt % and an organic layer and a manufacturing method thereof.

2. Description of the Related Art

An organic light emitting diode display is a self-emission displaydevice which has an organic light emitting diode which emits light todisplay an image. Since, unlike a liquid crystal display, the organiclight emitting diode display does not require a separate light source,it is possible to reduce a thickness and a weight thereof relative tothe thickness and weight required by a liquid crystal display. Further,since the organic light emitting diode display has high-gradecharacteristics such as low power consumption, high luminance, and ahigh response speed, the organic light emitting diode display receivesattention as a next-generation display device for portable electronicapparatuses.

The organic light emitting diode is an element emitting and dissipatinglight generated when an electron and a hole are coupled with each otherwithin the diode. Generally, the organic light emitting diode includesan electrode for injecting a hole (anode), an electrode for injecting anelectron (cathode), and an emission layer and has a structure in whichthe emission layer is laminated between a positive electrode, which isthe electrode for injecting a hole, and a negative electrode, which isthe electrode for injecting an electron. In detail, when the electron isinjected from the negative electrode of the organic light emitting diodeand the hole is injected from the positive electrode, charges thusgenerated are moved in opposite directions relative to each other by theexternal electric field formed by the electrodes and then are coupledwith each other in the emission layer to emit light, which is thendissipated from the emission layer. In the organic light emitting diode,the emission layer is made of a single molecular organic material or apolymer.

For example, the organic light emitting diode display (OLED) can be slimand flexible due to its more advantageous driving characteristics, and,as a result, much research relating to OLEDs is presently beingconducted.

However, the organic light emitting diode display has the characteristicthat the organic light emitting diode is deteriorated by the penetrationof oxygen or moisture. Accordingly, in order to prevent oxygen ormoisture from penetrating from the outside, an encapsulation structurefor sealing and protecting the organic light emitting diode is required.

As the encapsulation structure, a thin film structure which covers theorganic light emitting diode by a multilayer in which organic layers andinorganic layers are alternately laminated has been widely adopted. Thatis, the organic light emitting diode is sealed by alternately laminatingthe organic and inorganic layers on the organic light emitting diode ofthe substrate. Here, the organic layer mainly serves to give flexibilityto the organic light emitting diode display, and the inorganic layerserves to prevent oxygen or moisture from penetrating.

As a method of forming an inorganic layer in the related art,sputtering, atomic layer deposition (ALD) or the like is used. However,since the formed inorganic layer is made of only an inorganic material,adhesion to the organic layer is weak, and detachment occurs along aninterface between the inorganic layer and the organic layer. As aresult, there is a problem in that the reliability of the OLED productsis deteriorated.

In order to solve this problem, a plasma treatment is performed beforeand after forming the organic and inorganic layers, reducing theweakness of the adhesion between the organic layer and the inorganiclayer. However, when the plasma treatment process is added, there isstill a disadvantage in that the processing time is increased.

Accordingly, in order to form a more durable encapsulation layer againstpenetration of moisture and oxygen, a method of improving through arelatively simple process the adhesion between the organic layer and theinorganic layer while maintaining a barrier characteristic of theinorganic layer has been required.

SUMMARY OF THE INVENTION

The present disclosure has been made in an effort to provide an organiclight emitting diode display with a protective barrier excluding oxygenand moisture in which the barrier characteristic is not compromised, thestress within the barrier layer is reduced, and adhesion to organiclayers is improved. This is accomplished by controlling the content ofcarbon when forming an inorganic layer of an OLED encapsulation layer. Amanufacturing method thereof is also provided.

An exemplary embodiment of the present disclosure provides an organiclight emitting diode display including a substrate, an organic lightemitting diode formed on the substrate, and an encapsulation layerformed to cover the organic light emitting diode, the encapsulationlayer having a multilayer structure in which inorganic layers andorganic layers are alternately laminated, and the inorganic layercontaining carbon at a level of about 0.2 wt % to about 6.2 wt %.

The organic light emitting diode may include a first electrode, anorganic emission layer, and a second electrode, each of which issequentially formed.

A protective layer may be further included between the organic lightemitting diode and the encapsulation layer.

The inorganic layers and the organic layers may be laminated to form alaminated encapsulating barrier having 2 to 20 layers of each kind.

The organic material forming the organic layer may include one or morematerials selected from an acrylic resin, a methacrylic resin,polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, acellulose resin and a perylene resin.

The inorganic material forming the inorganic layer may include one ormore materials selected from silicon nitride, aluminum nitride,zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride,silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide,and silicon oxide nitride (SiON). In this case, the inorganic materialmay contain carbon at a level of about 0.2 wt % to about 6.2 wt %.

Another exemplary embodiment of the present disclosure provides amanufacturing method of an organic light emitting diode displayincluding preparing a substrate, forming an organic light emitting diodeon the substrate, and forming an encapsulation layer so as to cover theorganic light emitting diode, the step of forming of the encapsulationlayer including forming an inorganic layer and forming an organic layer,the inorganic layer comprising carbon at a level of about 0.2 wt % toabout 6.2 wt %.

The step of forming the organic light emitting diode may include forminga first electrode on the substrate, forming an organic emission layer onthe first electrode, and forming a second electrode on the organicemission layer.

An additional step of forming a protective layer may be further includedfollowing the step of forming the organic light emitting diode andpreceding the step of forming the encapsulation layer.

The step of forming the inorganic layer and the step of forming theorganic layer may be alternately performed 2 to 20 times each.

The organic material forming the organic layer may include one or morematerials selected from an acrylic resin, a methacrylic resin,polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, acellulose resin and a perylene resin.

In the step of forming the inorganic layer, an atomic layer deposition(ALD) method may be used.

In the step of forming the inorganic layer, the carbon content in theinorganic layer may be controlled by controlling any one of an amount ofa precursor, a reaction intensity of plasma, a reaction time of plasma,and chamber pressure. In this case, the plasma reaction may becontrolled by controlling the concentrations of N₂O and O₂.

The inorganic material may be selected from silicon nitride, aluminumnitride, zirconium nitride, titanium nitride, hafnium nitride, tantalumnitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide,cerium oxide, and silicon oxide nitride (SiON).

In an organic light emitting diode display according to an exemplaryembodiment of the present disclosure, it is possible to improve adhesionof an inorganic layer to an organic layer while maintaining a barriercharacteristic of an inorganic layer in an encapsulation layer of theorganic light emitting diode display by controlling the content ofcarbon contained in the inorganic layer of the encapsulation layer.

Further, in a manufacturing method of an organic light emitting diodedisplay according to an exemplary embodiment of the present disclosure,it is possible to shorten a processing time by eliminating the need forplasma treatment processes before and after forming organic andinorganic layers.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an organic light emitting diodedisplay according to an exemplary embodiment of the present disclosure.

FIG. 2 is a cross-sectional view of an organic light emitting diodedisplay according to another exemplary embodiment of the presentdisclosure.

FIGS. 3A to 3C are schematic diagrams for describing a manufacturingmethod of the organic light emitting diode display according to anexemplary embodiment of the present disclosure.

FIG. 4 is a schematic diagram of a process of forming an inorganic layerusing an atomic layer deposition method.

FIG. 5 is a diagram illustrating a method of testing adhesion that isexplained in Experimental Example 5 of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

Although the present disclosure can be modified variously and haveseveral embodiments, specific exemplary embodiments are illustrated inthe accompanying drawings and will be described in the specification.However, the scope of the present disclosure is not limited to thespecific embodiments described herein and should be construed asincluding all the changes, equivalents, and substitutions included inthe spirit and scope of the present disclosure.

Terms used in the present disclosure carry their usual meanings withinthe relevant art, but, in some cases, arbitrarily selected special termsare used, the special terms having meanings understood to be disclosedby the context of their use in the description of the presentdisclosure.

Parts of the subject OLEDs which are not essential to the description ofthe present invention are omitted from the description and drawings inorder to describe the present invention with greater clarity. Likereference numerals refer to like elements throughout the specification.Further, in the drawings, size and thickness of each element arearbitrarily illustrated for convenience of description, and the presentdisclosure is not necessarily limited to those embodiments illustratedin the drawings.

In the drawings, the thicknesses of layers and regions are exaggeratedfor convenience of description. It will be understood that when anelement such as a layer, film, region, or substrate is referred to asbeing “on” another element, it may be “directly on” the other element,or intervening elements may also be present.

FIG. 1 is a cross-sectional view schematically illustrating an organiclight emitting diode display according to an exemplary embodiment of thepresent disclosure.

As illustrated in FIG. 1, an organic light emitting diode displayaccording to an exemplary embodiment of the present disclosure includesa substrate 100, an organic light emitting diode 200 formed above thesubstrate, and an encapsulation layer 300 formed to cover the organiclight emitting diode. The encapsulation layer 300 has a multilayerstructure in which inorganic layers 310 and 330 and an organic layer 320are alternately laminated, and, in this case, the inorganic layers 310and 330 contain carbon at a level of about 0.2 wt % to about 6.2 wt %.

The substrate 100 is selected from a glass substrate and a transparentplastic substrate that has excellent mechanical strength, thermalstability, transparency, surface smoothness, handleability and waterrepellency. Although not illustrated in FIG. 1, a planarization layer,an insulating layer, and the like may be further provided above thesubstrate 100, and the substrate 100 may be variously modified.

The organic light emitting diode 200 is provided on the substrate 100.The organic light emitting diode 200 includes a first electrode 210, anorganic emission layer 220, and a second electrode 230.

The first electrode 210 may be formed using a vacuum deposition method,a sputtering method, or the like, and may be a cathode or an anode. Thefirst electrode 210 may be selected from a transparent electrode, atranslucent electrode, and a reflective electrode and may be formed byusing indium tin oxide (ITO), indium zinc oxide (IZO), tin oxide (SnO₂),zinc oxide (ZnO), Al, Ag, Mg and the like, but is not limited thereto.Further, the first electrode 210 may have a structure having two layersor more and comprising two or more different materials, and may bevariously modified.

The second electrode 230 may be formed using a vacuum deposition method,a sputtering method, or the like, and may be a cathode or an anode.Metal for forming the second electrode may be selected from a metalhaving low work function, an alloy, an electrically conductive compound,and a mixture thereof. For example, the metal may include lithium (Li),magnesium (Mg), aluminum (Al), aluminum-lithium (Al—Li), calcium (Ca),magnesium-indium (Mg—In), magnesium-silver (Mg—Ag) and the like.Further, the second electrode 230 may have a structure having two layersor more and comprising two or more different materials, and may bevariously modified.

The organic emission layer 220 is provided between the first electrode210 and the second electrode 230. The organic emission layer 220 mayinclude a light emitting material. For example, the light emittingmaterial may contain a host selected fromtris-(8-hydroxyquinoline)aluminum (Alq₃),4,4′-(N,N′-dicarbazole)biphenyl (CBP), poly(n-vinylcarbazole) (PVK), anddistyrylarylene (DSA) and a dopant selected from red dopants such asplatinum(II) octaethylporphine (PtOEP),tris-(1-phenyl-isoquinolinato-C2,N)iridium (Ir(piq)₃),bis(2-(2′-benzo[4,5-a]thienyl)pyridinato-N,C3′)iridium(acetyl-acetonate)Btp₂(Ir(acac), and4-(dicyanomethylene)-2-t-butyl-6-(1,1,7,7-tetramethyljulolidyl-9-enyl)-4H-pyran(DCJTB), green dopants such as tris(2-phenylpyridine)iridium (Ir(ppy)₃),acetylacetonatobis(2-phenylpyridine)iridium (Ir(ppy)₂(acac)), and2-[(4-methylpyridin-2-yl)phenyl]iridium (Ir(mpyp)₃), and blue dopantssuch as bis(4,6-difluorophenylpyridinato-N,C-2′)picolinato iridium(III)(F₂Irpic),iridium(m)bis[4,6-di-fluorophenyl)-pyridinato-N,C2′]picolinate ((F₂ppy)₂Ir(tmd)), tris[1-(4,6-difluorophenyl)pyrazolate-N,C2′]iridium(Ir(dfppz)₃), and ter-fluorene, but is not limited thereto.

Although not illustrated in detail in FIG. 1, one or more layersselected from a hole injection layer, a hole transport layer, a holestop layer, an electron transport layer and an electron injection layer,in addition to the organic emission layer 220, may be further includedbetween the first electrode 210 and the second electrode 230. The holeinjection layer, the hole transport layer, the electron transport layerand the electron injection layer may be formed using known materials andknown methods.

Although not illustrated in the drawing in detail, a protective layermay be provided on the organic light emitting diode 200. The protectivelayer may be made of a material selected from an organic material and aninorganic material, the protective layer being capable of preventing thesecond electrode 230 of the organic light emitting diode 200 from beingoxidized due to exposure to moisture and oxygen. Further, the protectivelayer may be formed by an organic/inorganic complex layer and may bevariously modified.

Referring to FIG. 1, the encapsulation layer 300 is provided to coverthe organic light emitting diode 200 and includes a first inorganiclayer 310, a first organic layer 320, and a second inorganic layer 330.

The encapsulation layer 300 may be formed in a multilayer structure inwhich the organic layers and the inorganic layers are alternatelylaminated with 2 to 20 layers each, but the respective numbers of theorganic layers and the inorganic layers are not limited thereto.

As described above, an example of the encapsulation layer formed byalternately laminating the organic layers and the inorganic layers isillustrated in FIG. 2.

The encapsulation layer 300 of the organic light emitting diode displayillustrated in FIG. 2 includes a first inorganic layer 310, a firstorganic layer 320, a second inorganic layer 330, a second organic layer340, and a third inorganic layer 350. In FIG. 2, the encapsulation layer300 including the three inorganic layers and the two organic layers isillustrated as an example, but the organic light emitting diode displayaccording to the present disclosure may include an encapsulation layerin which more organic layers and inorganic layers are alternatelylaminated.

In FIG. 2, a first organic material forming the first organic layer 320and a second organic material forming the second organic layer 340 maybe the same as each other or different from each other. Herein, forconvenience of the description, the first organic material forming thefirst organic layer 320 is described as an example, but other organiclayers forming the encapsulation layer 300 may be made of the followingarranged organic materials.

The first organic material forming the first organic layer 320 mayinclude one or more materials selected from an acrylic resin, amethacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, aurethane resin, a cellulose resin and a perylene resin.

In more detail, the acrylic resin may be selected from, withoutlimitation, butylacrylate, ethylhexylacrylate and the like, themethacrylic resin may be selected from, without limitation,propyleneglycol methacrylate, tetrahydrofurfuryl methacrylate and thelike, the vinyl resin may be selected from, without limitation, vinylacetate, N-vinylpyrrolidone and the like, the epoxy resin may beselected from, without limitation, cycloaliphatic epoxide, epoxyacrylate, vinyl epoxy resin and the like, the urethane resin mayinclude, without limitation, urethane acrylate and the like, and thecellulose resin may include, without limitation, cellulose nitrate andthe like. Similarly, a first inorganic material forming the firstinorganic layer 310, a second inorganic material forming the secondinorganic layer 330, and a third inorganic material forming the thirdinorganic layer 350 may be the same as each other or different from eachother. For convenience of the description, the inorganic materialforming the first inorganic layer 310 is described as an example, butother inorganic layers forming the encapsulation layer 300 may be madeof the following inorganic materials.

The first inorganic material forming the first inorganic layer 310 mayinclude one or more materials selected from silicon nitride, aluminumnitride, zirconium nitride, titanium nitride, hafnium nitride, tantalumnitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide,cerium oxide, and silicon oxide nitride (SiON).

The inorganic material of the inorganic layers may contain carbon at alevel of about 0.2 wt % to about 6.2 wt %. When the carbon content inthe inorganic material is less than about 0.2 wt %, adhesion to theorganic layer is weak, and, thus, a problem such as layer peeling mayoccur. When the carbon content in the inorganic material is more thanabout 6.2 wt %, the rate of occurrence of defects in the form of darkspots is gradually increased, and the ability of the inorganic layer toexclude oxygen and moisture is compromised. Accordingly, in order toimprove adhesion of the inorganic layer to the organic layer whilemaintaining the barrier characteristic of the inorganic layer, thecarbon content in the inorganic material forming the inorganic layer ispreferably kept in the range of about 0.2 wt % to about 6.2 wt %.

A manufacturing method of an organic light emitting diode displayaccording to an exemplary embodiment of the present disclosure includespreparing a substrate, forming an organic light emitting diode on thesubstrate, and forming an encapsulation layer to cover the organic lightemitting diode. In this case, the step of forming the encapsulationlayer includes forming an inorganic layer and forming an organic layer,and the inorganic layer may be formed of an inorganic materialcontaining carbon at a level of about 0.2 wt % to about 6.2 wt %.

The manufacturing method of an organic light emitting diode displayaccording to an exemplary embodiment of the present disclosure will bedescribed in more detail with reference to FIGS. 3A to 3C.

FIG. 3A illustrates forming an organic light emitting diode 200 on asubstrate 100.

The step of forming the organic light emitting diode 200 may includeforming a first electrode 210 on the substrate 100, forming an organicemission layer 220 on the first electrode 210, and forming a secondelectrode 230 on the organic emission layer 220.

A method of forming the first electrode 210, the organic emission layer220 and the second electrode 230 of the organic light emitting diode 200may be performed by using known deposition, sputtering, and coatingmethods. One or more of a hole injection layer, a hole transport layer,an electron transport layer and an electron injection layer may beformed between the first electrode 210 and the second electrode 230, inaddition to the organic emission layer 220, which is also disposedbetween the first electrode 210 and the second electrode 230.

After forming the organic light emitting diode 200 on the substrate 100,the encapsulation layer 300 is formed so as to cover the organic lightemitting diode 200. The step of forming the encapsulation layer 300 willbe described below in more detail with reference to FIGS. 3B and 3C.

As illustrated in FIG. 3B, a first inorganic layer 310 is formed tocover the organic light emitting diode 200 on the substrate 100, withthe organic light emitting diode 200 including the first electrode 210,the organic emission layer 220 and the second electrode 230.

A material forming the first inorganic layer 310 may be chosen fromthose described above. A method of forming the first inorganic layer 310may be an atomic layer deposition (ALD) method.

FIG. 4 is a schematic diagram illustrating a process of forming an AlOxinorganic layer by using an atomic layer deposition method, and the stepof forming the first inorganic layer 310 on the substrate 100 will bedescribed in more detail with reference to FIG. 4.

As illustrated in FIG. 4, in order to form the AlOx inorganic layer, aprecursor material comprising an Al-Carbon material is formed on thesubstrate in a single layer. Thereafter, a bond between Al and Carbon isbroken by forming a plasma having an oxygen source, the plasmafacilitating the formation of new aluminum-oxygen bonds. The process isrepetitively performed to form the AlOx layer having a desiredthickness.

As described above, since the adhesion between the AlOx inorganic layerand the organic layer is low, a plasma treatment process is performedbefore and after deposition in the related art to improve the adhesionbetween the inorganic layer and the organic layer.

In the manufacturing method according to an exemplary embodiment of thepresent disclosure, in the step of forming the first inorganic layer 310using the atomic layer deposition (ALD) method, in order to improve theadhesion between the first inorganic layer 310 and the first organiclayer 320, the carbon content may be controlled so as to contain carbonat a level of about 0.2 wt % to about 6.2 wt % in the inorganic materialforming the first inorganic layer 310.

The method of controlling the carbon content may include a method ofcontrolling an amount of the precursor, a method of controlling theconcentration of a plasma reactant such as one of O₂ and N₂O and theduration of exposure to the plasma, a method of controlling chamberpressure, and the like, and, further, may use other methods ofcontrolling the carbon content in the inorganic material as explained inthe related art.

By the method as described above, the carbon content of an inorganiclayer is controlled by forming an inorganic layer partially containingan organic carbon material, not an inorganic layer made of only a pureinorganic material, and thus adhesion of the inorganic layer to theorganic layer is improved, and an inorganic layer having a barriercharacteristic capable of preventing moisture and oxygen frompenetrating may be formed.

Thereafter, as illustrated in FIG. 3C, the first organic layer 320 andthe second inorganic layer 330 are sequentially formed on the firstinorganic layer 310.

A material forming the first organic layer 320 may be selected fromthose described above for an organic layer. The method of forming thefirst organic layer 320 may variously use general methods of forming alayer, for example, a coating and heat-treatment method, a depositionmethod, and the like.

The material and the method of forming the second inorganic layer 330may be the same material and method as employed for the first inorganiclayer 310 described above and may be selected from the materials andmethods described above.

In FIG. 3C, an example of additionally forming the first organic layer320 and the second inorganic layer 330 on the first inorganic layer 310is illustrated, but the step of forming the inorganic layer and the stepof forming the organic layer are alternately performed 2 to 20 timeseach to form the encapsulation layer laminated with multilayered organicand inorganic layers.

Hereinafter, a method of controlling the carbon content according to anexemplary embodiment of the present disclosure will be described in moredetail with reference to Experimental Examples.

EXPERIMENTAL EXAMPLES

A substrate with an organic light emitting diode was prepared and thenan AlOx inorganic layer was formed so as to cover the organic lightemitting diode by performing an atomic layer deposition (ALD) methodusing trimethyl aluminum (TMA). A method for controlling the carboncontent included in the formed AlOx inorganic layer and the resultaccording to the method will be described with reference to thefollowing Experimental Examples 1 to 3.

Experimental Example 1

In order to investigate a possible way to control the carbon content inthe AlOx inorganic layer, the carbon content was measured as functionsof the flow rates of N₂O and O₂, which are plasma reactants. The resultsare illustrated in the following Tables 1 and 2, respectively.

TABLE 1 N₂O flow rate Carbon content (SCCM) in AlOx (wt %) 50 10.2 1005.3 150 1.7 200 0.3 250 0.2 300 Not measurable

TABLE 2 O₂ flow rate Carbon content (SCCM) in AlOx (wt %) 50 6.2 100 3.7150 1.0 200 Not measurable 250 Not measurable 300 Not measurable

As illustrated in Tables 1 and 2, in the ALD process, the carbon contentin AlOx may be controlled by controlling the flow rate of N₂O and theflow rate of O₂, N₂O and O₂ being the plasma reactants. In detail, asthe flow rate of N₂O was increased, the carbon content in AlOx wasdecreased, and as the flow rate of O₂ was increased, the carbon contentin AlOx was decreased.

Experimental Example 2

This example investigates another possible way to control the carboncontent in the AlOx inorganic layer. In order to investigate the carboncontent of the AlOx inorganic layer as a function of plasma chamberpressure during formation of the inorganic layer, the carbon content wasmeasured over a series of chamber pressures under conditions in whichthe N₂O plasma gas flow rate was held constant at 200 sccm. The resultsare illustrated in Table 3.

TABLE 3 Chamber pressure Carbon content (mtorr) in AlOx (wt %) 1 0.2 100.2 100 0.3 200 1.1 300 9.8 500 17.3

As illustrated in Table 3, as the pressure in the chamber was increased,the carbon content in AlOx was increased.

Experimental Example 3

This example investigates another possible way to control the carboncontent in the AlOx inorganic layer. The carbon content in the AlOxinorganic layer resulting from plasma treatment of the TMA-treatedsubstrate was measured as a function of the surface concentration of theTMA prior to plasma treatment. During these experiments, N₂O flow ratewas held constant at 200 sccm, N₂O being a plasma reactant, and thechamber pressure was held constant at 10 mtorr. The results areillustrated in Table 4.

TABLE 4 Amount of TMA Carbon content (wt %) in AlOx (wt %) 1 0.1 5 0.110 0.6 20 4.8 50 15.6

As illustrated in Table 4, as the amount of the TMA was increased, thecarbon content in AlOx was increased.

As illustrated in Experimental Examples 1 to 3, the carbon content inAlOx may be controlled by controlling the flow rate of N₂O, the flowrate of O₂, the pressure in the chamber, and the amount of TMA bonded tothe substrate surface prior to plasma treatment.

Experimental Example 4

Samples with the ALD layer formed in Experimental Examples 1 to 3 wereexamined to determine the rate of occurrence of a dark spot defect as afunction of the carbon content of the ALD-deposited inorganic layer. Thesamples were stored for 120 hr in a reliable chamber under conditions ofa controlled temperature at 85° C. and a controlled humidity at 85%, andthe rate of occurrence of dark spot defects was then determined. Theresults are illustrated in Table 5.

TABLE 5 Defect rate of dark spot (%) Carbon content (Reliability 120 hr@ in AlOx (wt %) 85° C./85% RH) Note 10.2 25.3%  6.2 10.0%  5.3 7.8% 4.83.4% 3.7 2.9% 1.7 3.5% 0.2 2.3% 0.2 or less 100 No light (limit of (Nolight emission of overall emission measurement) cells due to layerlifting)

As illustrated in Table 5, when the carbon content in AlOx was more than6.2 wt %, the rate of occurrence of the dark spot defects was greatlyincreased.

Experimental Example 5

Two samples of ALD layers that were formed on glass substrates withcontrol of the carbon contents of the respective ALD layers weresubjected to testing of the adhesion between the ALD-deposited inorganiclayers and an organic layer which had been interposed between andadhered to each of two of the substrate-bound inorganic ALD layers asillustrated in FIG. 5. A peeling degree was observed, and then the peeladhesion between the respective inorganic layers and the organic layerwas measured. The results are illustrated in Table 6.

TABLE 6 Carbon content Adhesion (kgf/mm) in AlOx (wt %) (@ 25° C./48%RH) Note 10.2 0.86 6.2 0.81 5.3 0.83 4.8 0.82 3.7 0.79 1.7 0.79 0.2 0.750.2 or less 0.31 Layer peeling (limit of occurs measurement)

As illustrated in Table 6, when the carbon content in AlOx was less than0.2 wt %, the adhesion between the inorganic layer and the organic layerwas weak and thus layer peeling occurred, but when the carbon contentwas 0.2 wt % or more, the adhesion was good.

Accordingly, in the present disclosure, when the ALD inorganic layer isformed while controlling the carbon content in AlOx to be about 0.2 wt %to about 5 wt %, the function of the ALD inorganic layer as the barrierlayer is maintained, the rate of occurrence of the dark spot defects isnot large, and the adhesion between the inorganic layer and adjacentorganic layers is good. As a result, it is possible to provide anorganic light emitting diode display that is not prone to peeling of theinorganic layer.

In the encapsulation layer including the organic layer and the inorganiclayer formed by the atomic layer deposition method in the related art,since the adhesion between the inorganic layer and the organic layer isweak, light emission may be occluded due to layer peeling, and anadditional plasma process is required before and after forming thelayers in order to improve the adhesion.

In contrast, according to an exemplary embodiment of the presentdisclosure, by controlling the carbon content included in the inorganiclayer in the process of forming the inorganic layer by the atomic layerdeposition method, the barrier characteristic capable of preventingmoisture and oxygen from penetrating may be maintained, adhesion to theorganic layer may be improved, and, as a result, the organic lightemitting diode display according to the present disclosure may solveproblems such as layer peeling and the occurrence of dark spot defects.

Further, by improving the adhesion by controlling the carbon content,since a separate plasma treatment process is not required before andafter forming the layers, processing time may be shortened as comparedwith the manufacturing method of the organic light emitting diodedisplay in the related art, in which plasma treatment was performedbefore and after forming the layers.

From the foregoing, it will be appreciated that various embodiments ofthe present disclosure have been described herein for purposes ofillustration, and that various modifications may be made withoutdeparting from the scope and spirit of the present disclosure.Accordingly, the various embodiments disclosed herein are not intendedto be limiting, with the true scope and spirit being indicated by thefollowing claims.

What is claimed is:
 1. An organic light emitting diode display,comprising: a substrate; an organic light emitting diode formed on thesubstrate; and an encapsulation layer formed to cover the organic lightemitting diode, the encapsulation layer having a multilayer structure inwhich inorganic layers and organic layers are alternately laminated, theinorganic layer including carbon at a level of about 0.2 wt % to about6.2 wt %.
 2. The organic light emitting diode display of claim 1, theorganic light emitting diode including a first electrode, an organicemission layer, and a second electrode, the first electrode, organicemission layer, and second electrode being sequentially formed.
 3. Theorganic light emitting diode display of claim 1, a protective layerbeing further included between the organic light emitting diode and theencapsulation layer.
 4. The organic light emitting diode display ofclaim 1, the inorganic layers and the organic layers being alternatelylaminated with 2 to 20 layers.
 5. The organic light emitting diodedisplay of claim 1, an organic material forming the organic layerincludes one or more materials selected from an acrylic resin, amethacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, aurethane resin, a cellulose resin and a perylene resin.
 6. The organiclight emitting diode display of claim 1, an inorganic material formingthe inorganic layer including one or more materials selected fromsilicon nitride, aluminum nitride, zirconium nitride, titanium nitride,hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide,titanium oxide, tin oxide, cerium oxide, and silicon oxide nitride(SiON).
 7. The organic light emitting diode display of claim 6, theinorganic material including carbon at a level of about 0.2 wt % toabout 6.2 wt %.
 8. A manufacturing method of an organic light emittingdiode display, comprising: preparing a substrate; forming an organiclight emitting diode on the substrate; and forming an encapsulationlayer so as to cover the organic light emitting diode, the step offorming the encapsulation layer including forming an inorganic layer andforming an organic layer, the inorganic layer including carbon at alevel of about 0.2 wt % to about 6.2 wt %.
 9. The manufacturing methodof an organic light emitting diode display of claim 8, the step offorming the organic light emitting diode including forming a firstelectrode on the substrate, forming an organic emission layer on thefirst electrode, and forming a second electrode on the organic emissionlayer.
 10. The manufacturing method of an organic light emitting diodedisplay of claim 8, further comprising forming a protective layerbetween the step of forming the organic light emitting diode and thestep of forming the encapsulation layer.
 11. The manufacturing method ofan organic light emitting diode display of claim 8, the steps of formingthe inorganic layer and forming the organic layer being performed 2 to20 times each.
 12. The manufacturing method of an organic light emittingdiode display of claim 8, the organic material forming the organic layerincluding one or more materials selected from an acrylic resin, amethacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, aurethane resin, a cellulose resin and a perylene resin.
 13. Themanufacturing method of an organic light emitting diode display of claim8, an atomic layer deposition (ALD) method being used in the step offorming the inorganic layer.
 14. The manufacturing method of an organiclight emitting diode display of claim 8, the inorganic materialincluding one or more materials selected from silicon nitride, aluminumnitride, zirconium nitride, titanium nitride, hafnium nitride, tantalumnitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide,cerium oxide, and silicon oxide nitride (SiON).
 15. The manufacturingmethod of an organic light emitting diode display of claim 8, the stepof forming the inorganic layer including controlling the carbon contentin the inorganic layer by controlling any one of an amount of aprecursor, a reaction intensity of plasma, a reaction time of plasma,and chamber pressure.
 16. The manufacturing method of an organic lightemitting diode display of claim 15, the plasma reaction being controlledby controlling concentrations of N₂O and O₂.